TRI
TR7700QE-S
TRI | AOI
The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with metrology capabilities and flexible inspection algorithms.
- Semiconductor and Packaging technology Inspection.
- Ultra-High Precision Stop-and-Go 3D AOI.
- Inspection of Wire Bonding and Die Bonding Defects.
- Ready to Inspect in Minutes with TRI's Smart Inspection Library.
| Model | TR7700QE-S |
|---|---|
| Imaging Method | Stop-and-Go Imaging |
| Top Camera | 12 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 5.5 µm |
| Lighting | Multi-phase true color LED |
| 3D Technology | Quad Digital Fringe Projectors |
| Max. 3D Range | 12 Mpix@ 5.5 µm: 4 mm |
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