TREND | Products

TRI's ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.

High Speed 2D + 3D Inspection of Up to 01005 Components.
High Defect Coverage Using Hybrid 2D + 3D Inspection Technology.
True 3D Profile Measurement Using Dual Laser Units.
Intelligent Rapid Programming Interface with Auto Library and Offline Editing.

Model	TR7700 SIII 3D
Imaging Method	Dynamic Imaging with true 3D profile measurement
Top Camera	4 Mpix
Angle Camera	N/A
Imaging Resolution	10 µm, 15 µm (factory setting)
Lighting	Multi-phase RGB+W LED
3D Technology	Single/Dual 3D laser sensors
Max. 3D Range	20 mm

Model

TR7700 SIII 3D

Imaging Method

Dynamic Imaging with true 3D profile measurement

Top Camera

4 Mpix

Angle Camera

N/A

Imaging Resolution

10 µm, 15 µm (factory setting)

Lighting

Multi-phase RGB+W LED