TREND | Products

TRI's optimum 3D AOI solution delivers the fastest multi-angle PCB inspection coupled with blue-laser-based true 3D profile measurement for the highest automated optical defect symptoms coverage possible. Combining state-of-the-art software solution and third generation intelligent hardware platform, the TR7500 SIII 3D offers robust 3D solder and component defect inspection and with high inspection coverage and easy programming.

High Speed Color Multi-angle Inspection of Up to 01005 Components.
High Defect Coverage Using Hybrid 2D+3D Inspection Technology.
True 3D Profile Measurement Using Dual Laser Units.
Rapid Programming Interface with Auto Library and Offline Editing.

Model	TR7500 SIII 3D
Imaging Method	Dynamic Imaging with true 3D profile measurement
Top Camera	4 Mpix
Angle Camera	1.3 Mpix or 6.5 Mpix (factory setting)
Imaging Resolution	Optical: 10 µm, 15 µm Laser: 10 μm (optional), 20 μm, 50 μm Note: Factory setting
Lighting	Multi-phase RGB+W LED
3D Technology	Single/Dual 3D laser sensors
3D Inspection Range	20 mm

Model

TR7500 SIII 3D

Imaging Method

Dynamic Imaging with true 3D profile measurement

Top Camera

4 Mpix

Angle Camera

1.3 Mpix or 6.5 Mpix (factory setting)

Imaging Resolution

Optical: 10 µm, 15 µm
Laser: 10 μm (optional), 20 μm, 50 μm
Note: Factory setting

Lighting

Multi-phase RGB+W LED