TREND | Products

TR7600XLL SII is high performance and high speed 3D AXI for the largest server, networking and power PCBs. The TR7600XLL SII systems uses TRI's unique shadow-free technology to inspect multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs and Press-fit connectors. Smart programming assistants and multi-resolution programs help maximize production yields on any production line.

Very Large board edge to edge inspection up to 1000 mm x 660 mm.
Automated programming saves hours of engineer workload.
Multi resolution programs and advanced processing for superior image quality.
Automatic 2D + 3D slice image extraction using Digital Tomosynthesis.
X-ray tube with adjustable output up to 130 kV/300 µA.

Model	TR7600XLL SII CT
Camera	High-performance, ultra-sensitive bidirectional line-scan cameras
X-ray Source	Microfocus tube 130 kV max (user adjustable)
Imaging Resolution	7 µm, 10 µm, 15 µm, 20 µm (3 settings factory configured)
Inspection Method	2.5D, 3D Slicing, Planar CT

Model

TR7600XLL SII CT

Camera

High-performance, ultra-sensitive bidirectional line-scan cameras

X-ray Source

Microfocus tube 130 kV max (user adjustable)

Imaging Resolution

7 µm, 10 µm, 15 µm, 20 µm (3 settings factory configured)

Inspection Method

2.5D, 3D Slicing, Planar CT