TREND | Products

Built for maximum inspection performance, TR7600X SII series offers ultimate performance 3D X-ray inspection for the largest server, networking and power PCBs. With advanced ultra-high-speed cameras, the TR7600X SII series combines TRI’s unique shadow-free 3D inspection of multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs, Press-fit connectors with fully automated programming and multi-resolution programs help maximize production yields on any production line.

Ultra-high-speed bidirectional cameras
Large board edge to edge inspection up to 900 mm x 460 mm.
X-ray tube with adjustable output up to 130 kV/300 µA.
Multi resolution BlockScan programs and advanced processing for superior image quality.
Automatic 2D + 3D slice image extraction using Digital Tomosynthesis.
Exclusive Image enhancement technology for clear Pressfit inspection.

Model	TR7600 SIII
Camera	High-performance, ultra-sensitive bidirectional line-scan cameras
X-ray Source	Microfocus tube 130 kV max (user adjustable)
Imaging Resolution	10 µm, 15 µm, 20 µm (factory setting)
Inspection Method	2.5D, 3D Slicing, Planar CT (optional)

Model

TR7600 SIII

Camera

High-performance, ultra-sensitive bidirectional line-scan cameras

X-ray Source

Microfocus tube 130 kV max (user adjustable)

Imaging Resolution

10 µm, 15 µm, 20 µm (factory setting)

Inspection Method

2.5D, 3D Slicing, Planar CT (optional)