TREND | Products

Stable and tall deposits ensure contact even with 1005 chip components. JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits. Therefore, contact with surface-mounted components of any shape is achieved, improving reliability of the wave soldering process.
Resistant to heat slump. JU-110-3 is resistant against heat slump, maintaining the height of deposits throughout the process. The height of deposits and contact with surface-mounted components are maintained even during heating, securely holding the components in place.
Compliant to REACH regulation. JU-110-3 has significantly reduced the content of one of the substances of very high concern (SVHC) as regulated by the European Chemical Agency (ECHA), and is compliant to the REACH regulation.

Model

JU-110-3

State / Color

Paste, red

Curing condition

130ºC, >60sec.

Product Category

Heat Curable SMT Adhesive

Transition Temperature(℃)

Shelf life (0-10℃)

6 months