TRI
TR7007 SII
TRI | SPI
Offering inspection speeds of up to 200 cm²/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system’s hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
- World’s fastest inspection speed up to 200 cm2/sec @ 15 µm.
- Shadow free Fringe Pattern lighting technology.
- Optical Resolution 10 µm or 15 µm.
- Linear motor X-Y table for vibration free accurate inspection.
| Model | TR7007 SII |
|---|---|
| Imaging Method | Dynamic Imaging |
| Camera | 4 Mpix |
| Imaging Resolution | 10 µm or 15 µm (factory setting) |
| Lighting | RGB LED |
| 3D Technology | 2-way Digital Fringe Pattern |
| Field of View | 4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm |
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