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Applicable to 0402 chip component with AIR reflow atmosphere.
Reduces defects during stencil printing with a newly developed lubrication technique. S3X70-G835 adopts a type of non-volatile solvent as its primary constituent,and can keep itself from drying when the paste is left idle. A better print-to-pause property results, ensuring a consistent printability and workability even after a 60-min. pause.
Excellent meltability and wettability on micro-patterns in air reflow. Although the size of the S3X70-G835 solder particle is Type 5, the product exhibits good meltability and wettability without a Nitrogen atmosphere. This has been enabled by a newly engineered flux formulation optimized for Type 5 powders.
Reduced voids with various board surface finish treatments. In addition to having good melting properties, S3X70-G835 displays excellent wetting performance on various board surface finishes. This helps the molten solder to quickly push out flux elements, and reduces the occurrence of voids as a result.

Model

S3X70-G811

Composition

Sn 3.0Ag 0.5Cu

Particle Size（μm）

10-25

Flux Content(%)

12.0 ± 1.0

Flux Type

ROL0 (IPC J-STD-004A)

Product Category

Solder Paste