KOKI
S3X58-M500C-7
KOKI | Solder Paste
- Good and consistent wetting spreading to oxidized metal surface.
| Model | S3X58-M500C-7 |
|---|---|
| Composition | Sn 3.0Ag 0.5Cu |
| Particle Size（μm） | 20-38 |
| Flux Content(%) | 11.8 |
| Flux Type | ROL0（IPC J-STD-004) |
| Product Category | Solder Paste |
| Melting Point(℃) | 217 - 219 |
| Viscosity（Pa.s） | 200 |
| Halide content(%) | 0 |
| Optical Powder Size（μm） | 0 |
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