The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with metrology capabilities and flexible inspection algorithms.
|Imaging Method||Stop-and-Go Imaging|
|Top Camera||12 Mpix|
|Imaging Resolution||5.5 µm|
|Lighting||Multi-phase true color LED|
|3D Technology||Quad Digital Fringe Projectors|
|Max. 3D Range||12 Mpix@ 5.5 µm: 4 mm|