Long-lasting transfer quality. Refining thixotropic agents allowed TF-MP2 to maintain the transferred shapes intact for a long period of time. Consistent transfer quality and rolling quality are achieved.
Swift solder spreading and assured melting. Wetting speed is improved to achieve speedy spreading. TF-MP2 ensures swift melting of solders during PoP assembly.
Improved heat resistance prevents joint defects. Oxidation of BGA balls during pre-heating is minimized, and solder swiftly melts and spreads after reaching the melting point. Joint defects are prevented by letting BGA components settle down at once.