Achieves powerful wet characteristics with new flux technology. The power of the flux reduces coating unevenness and fits well on the substrate, forming a flux film evenly. Since all oxides can be removed, stable soldering quality can be obtained with no variation in through-hole climbing.
Outstanding through-hole up. Optimized all flux action during preheating and soldering. The through-hole-up characteristics, which are the lifeline of soldering quality, have been thoroughly improved.
The aim was overwhelming wet speed. In addition to general Sn plating, even when poorly wet materials such as brass and nickel are exposed by double-sided plating, they quickly get wet and achieve a wide range of versatility.