Best suited for keeping large components from fallimg off during double-sided reflow.
Helps keep components on the board from falling, shifting, or floating during reflow. Using a conventional adhesive with solder paste can result in the lifting of components during reflow because the adhesive cures before the solder paste melts. JU-R4S maintains its fluidity while the solder is molten and facilitates setting of the components.
Allows solder paste self-alignment at reflow. JU-R4S is designed to commence curing after the solder (SAC305) has melted. Therefore, JU-R4S does not hinder self-alignment of components that may occur when the solder has melted.
Stable dispense shape and superior electrical reliability after curing. Dispensability of JU-R4S was improved by reducing the viscosity while shape retention was also improved by optimizing the TI value. The resultant tall deposits ensure contact and adhesion even for tall components.